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Tech Driven EMS

Signed in as:

filler@godaddy.com

  • Home
  • Company
    • Company Info
    • Mission Statement
    • Customer Feedback
    • Rewards Program
    • Referral Program
    • College Programs
    • Our Foundations
    • Careers
  • Services
    • Full Circuit Solution
    • Engineering Services
    • Layout Design
    • Rigid PCB Manufacturing
    • Flex PCB Manufacturing
    • PCB Assembly Services
    • Seamless Offshore
    • Surface Parts
  • Capabilities
    • PCB Capabilities
    • PCBA Capabilities
    • Certifications & Tests
    • Materials
  • Tech Support
    • Tech Seminars
    • DFM Services
    • Technical Pages
    • Market Segments
  • Partners
    • Industry Support
    • Industry Networking
    • Partner Qualification
    • Factory Tours
    • Silicon Valley Tours
  • Contact
    • Contact Us
    • Mutual NDA
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    • Place Order/Make Payment
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Rigid PCB Manufacturing

Reducing Cost in PCB Manufacturing:

Low-cost PCB Manufacturing with reliability aims to look at the design or product from a printed circuit board manufacturer's perspective. What this means is that you need to understand, as a designer or a buyer, the true PCB complexity, the number of manufacturing processes & the equipment set required to get the product done with the highest yields at the best possible price. Picking the correct solution or vendor is getting increasingly complex because of the diverse technology mix in any given system. The most cost-effective manufacturing solution is to split up the builds based on technology among two or even three PCB manufacturers for maximum cost and efficiency. This can be challenging if the manufacturing solution isn't appropriately developed and managed in real time for success. Tech-Driven EMS's 25 years of knowledge and experience working with these vendors will ensure product-to-market success at the lowest possible cost.

Tech Downloads

Design-for-Manufacturability Guidelines (pdf)

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Process flow chart (pdf)

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HDI Mfg. Capabilities (pdf)

Download

Industry Technology

Types Of Array Packages

Uyemura Surface Finish:

Uyemura Surface Finish:

  •   Ball Grid Arrays “BGA”
  •   Flip Chip
  •   Pin Grid Arrays “PGA"   
  •   Land Grid Array “LGA”
  •   Ceramic Column Grid Array “CCGA”

Uyemura Surface Finish:

Uyemura Surface Finish:

Uyemura Surface Finish:

New "hybrid" gold from Uyemura combines immersion and autocatalytic deposition. TWX-40 mixed reaction bath is a single immersion gold bath with autocatalytic capabilities, depositing 4-8 µin - a proven alternative to extended dwell times.

Epoxy Fill Materials

Epoxy Fill Materials

Epoxy Fill Materials

  • Ormit Paste (Connect Pcbs)
  • Sani-ie Fill (Buried Vias)
  • CB 100

Specialty Materials

Epoxy Fill Materials

Epoxy Fill Materials

Stablecor


"Tech Driven's team was a big help in introducing us to the material Stablecor, which has great thermal characteristics.  The program I am working on is in the early stages of establishing a platform that we believe will set the standard for solar power in space."

Steve

Sierra Nevada


Tech Downloads

Design Guideline For Fine Pitch BGAs (pdf)

Download

Epoxy Fill San-Ei (doc)

Download

TD Ormet Conductive Paste (pdf)

Download

Advanced Multilayer Flex & Rigid Flex

BookBinder Technology for Flex

BookBinder Technology for Flex

BookBinder Technology for Flex

This Flex technology calls for staggering the length of each flexible layer, which eliminates the buckling and dramatically reduces the compression/tension forces that are introduced when multiple flex layers are bent into configuration. The result is a much more flexible and durable end product. 

Blind & Buried Vias Technology

BookBinder Technology for Flex

BookBinder Technology for Flex

All of today’s advanced rigid PCB manufacturing technologies can be used in rigid-flex designs. Tech Driven extensive experience fabricating flex & rigid-flex with features such as laser-drilled micro vias, sequential laminations, epoxy fill, copper-filled vias, via-in-pad, and other advanced construction technologies.

Shielding Technology (silver Ink)

Shielding Technology (silver Ink)

Shielding Technology (silver Ink)

Dupont CB028 is a flexible silver-loaded polymer ‘ink’ created explicitly for EMI/RFI shielding on flex applications. Substantial gains in flexibility can be achieved in many cases by replacing the copper shield layers with silver ink. The average thickness of the silver ink layer is approximately one mil.

Constantan

Shielding Technology (silver Ink)

Shielding Technology (silver Ink)

This material can be used in place of copper to form conductors when heat load is a major consideration. Typical applications for this type of thermal management are focal plane arrays in infrared (IR) imaging equipment. We have also used adhesive-less constantan laminates for controlled resistance via copper micro-plating.

Tech Downloads

IPC Mfg. Standards (doc)

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Class 3 Design Guidelines (pdf)

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Design Guideline For Fine Pitch BGAs (docx)

Download

PCBA & Box Build Assembly Services

Full Circuit Solution

We support a full service contract manufacturing offering comprehensive fabrication, assembly and test services for Prototype through Volume Production for advanced designs in commercial, Industrial, Networking, Medical & Military/Aerospace.

Services

  • Flexible Circuits (All Types)
  • Advanced Surface Mount Technology (SMT/PCBA)
  • ​​Micro Ball Grid Array (BGA Sub .4mm) 
  • Through-Hole Assembly Lead-Free (Lead-Free Part Conversion)​
  • Separate Leaded line available 
  • Configure-To-Order (BTO/CTO)
  • Small parts Assembly capable  (201s, 402s)
  • ​Conformal Coating, Under fill & Bonding
  • Wire Bonding Capable 
  • ​Machining & Enclosures
  • Cabling
  • ​Plastic Injection Molding​​

Advanced Microelectronics Assembly

Our Microelectronic Assembly Operation offers high density, direct chip attach miniaturization solutions, including services from front end development through full production; Flex, Rigid-Flex and ceramic substrates, which are used as platforms for microelectronic assembly.


Custom assemblies for medical, security, military, telecom, solar, aviation, and space applications have been the backbone of our module and hybrid manufacturing activity for nearly  years. With the ability to choose from a variety of technologies Electronics can offer a solution to most packaging challenges.

Leading HDI Technology

Flip chip assembly down 1.5mm square die, 8-Al and Au wire bonding capabilities down to 3-mil pitch

Lean Manufacturing

Manufacturing performed in (2) Class 10,000 controlled environments.


Assembly Materials:

  • Standard FR4
  • BT
  • Polyimide 
  • Ceramic
  • Rogers 4003

Some of the key building blocks in our technology include:

  • Wafer Sawing
  • Precision die placement
  • Automated wire bonding
  • Material dispensing Multi-chip assemblies

Tech Downloads

DFM for PCB Assembly (DFMA or PCBA) (pdf)

Download

Advanced Flip Chip Design Rules (pdf)

Download

Class 2 verses Class 3 for PCBA Assembly (pdf)

Download

Military & Aerospace

High Reliability Applications

High Reliability Applications

High Reliability Applications

Tech Driven Circuits represents the most advanced printed circuit board manufacturers in the United States committed to innovation and excellence. Our multiple state-of-the-art facilities are ITAR registered and have been certified to meet or exceed all major Military & Aerospace requirements. 

Quality Assurance Systems

High Reliability Applications

High Reliability Applications

Your Team can count on Tech Driven's technical expertise and the High-Rel vendors we have in place to provide our aerospace & defense customers with the manufacturing reliability and performance required for today's vendor's critical applications.  Our multiple state-of-the-art facilities are Mil- 31032, Class(3A) & ITAR registered, and have been certified to meet or exceed all major Mil/Aero requirements.


Certifications/Registration

High Reliability Applications

Certifications/Registration

MIL-PRF-31032
MIL-PRF-55110
ISO 9001-2008
AS9100C
ITAR
UL-94-VO, DSR
IPC-6012A Class 3 (DS)

Made To Never Fail

Capabilities for Highly Specialized Aerospace & Defense

Certifications/Registration

We know and understand through experience what it takes to be successful with DOD & Flight contacts. Not only are we providing our customers with high quality standards, but a complete inspection delivery package with the required detail that is a must each and every delivery . .

Capabilities for Highly Specialized Aerospace & Defense

Capabilities for Highly Specialized Aerospace & Defense

Capabilities for Highly Specialized Aerospace & Defense

 Our advanced technology allows us to meet the most advanced Design criteria & rigorous requirements with the precision and performance our customers demand. Some of our capabilities include: up to 70 layer boards, via-in-pad, sequential lamination (9), laser drilled microvias, oversized boards (24 x 30), heavy copper up to 15 oz., laser direct imaging (12 Microns), cavity boards, and microwave/antenna boards.

Superior Quality

Capabilities for Highly Specialized Aerospace & Defense

Capabilities for Highly Specialized Aerospace & Defense

I can honesty can say that I have never had a product fail in the field or even experience a product return to delay any of my critical programs. Quality always comes first with Tech Driven EMS.

                                        

                              Chris Donavon

                                        Aerospace Engineer

Tech Downloads

Compare Class 2 Verse Class 3 & 3a (pdf)

Download

Class_3_dfm_manual (pdf)

Download

IPC 6012 Class 3 Standard (pdf)

Download

Materials for the PCB

Material selection is an important part of  you PCB design and manufacturing solution to ensure superior performance  & reliability. Our Manufactures and PCB material Suppliers offer a large selection of advanced materials to meet the industry demand. We stock over 70 Different brands and glass types to meet everything market and product mix from your every day low cost solutions to the extreme high speeds low loss requirements.

Roger Corp's Key Products/Brands:

  • RT/duroid® High Frequency Laminates
  • RO4000® High Frequency Circuit Materials
  • RO3000® High Frequency Laminates
  • TMM® Thermoset Microwave Materials


Applications:

  • Wireless Base Stations
  • Aerospace & Defense
  • Automotive
  • High Speed Digital

Nelco Featured Electronic Materials:

  • Meteorwave® Family 
  • New very low loss, very high reliability
  • N4800-20 and N4800-20 SI® New high speed / low loss with Lead-free.
  • N4000-13 high speed digital, low loss epoxy material, Featuring outstanding thermal and electrical properties.
  • N4000-13 EP™ providing enhanced thermal reliability and CAF resistance for high temperature and lead-free
  • All Nelco materials are RoHS compliant

Arlon Polymide PCB Materials:

  • 33N Resin
  • 35N Resin

No Flow Pcb Materials:

  • 38N Flex
  • 51N FlexMeteorwave® Family 
  • New very low loss, very high reliability
  • N4800-20 and N4800-20 SI® New high speed / low loss with Lead-free.
  • N4000-13 high speed digital, low loss epoxy material, Featuring outstanding thermal and electrical properties.
  • N4000-13 EP™ providing enhanced thermal reliability and CAF resistance for high temperature and lead-free
  • All Nelco materials are RoHS compliant
  • Zeta Thin-fFlm-Dialectrics

Isola -Group Material

  • BT/ epoxy
  • Halogen Free
  • High-Density Interconnect
  • High Speed Digital
  • High Thermal Conductivity
  • HiHigh-Speedgh Thermal Reliability
  • Lead-Free Compatible
  • Low CTE z-axis
  • No / Low Flow Pre-preg
  • Polyimide
  • RF Hybrid
  • Signal Integrity  
  • Nelco Featured Electronic Materials: 
  • Meteorwave® Family 
  • New very low loss, very high reliability
  • N4800-20 and N4800-20 SI® New high speed / low loss with Lead-free.
  • N4000-13 is a high-speed digital, low-loss epoxy material featuring outstanding thermal and electrical properties.
  • N4000-13 EP™ provides enhanced thermal reliability and CAF resistance for high temperature and lead-free
  • All Nelco materials are RoHS-compliant

Tech Downloads

FR408HR Dk_Df_Tables (pdf)

Download

370HR__Dk_Df_Tables (pdf)

Download

EM-827 Datasheet-20221101_23010511484 (pdf)

Download
  • Company Info
  • Full Circuit Solution
  • Engineering Services
  • Layout Design
  • Rigid PCB Manufacturing
  • Flex PCB Manufacturing
  • PCB Assembly Services
  • Seamless Offshore
  • Surface Parts
  • Contact Us

Tech Driven EMS

408 410 0259 Info@TechDrivenEMS.com

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