Engineering Services

• Ball Grid Arrays “BGA”
• Flip Chip
• Pin Grid Arrays “PGA"   
• Land Grid Array “LGA"
• Ceramic Column Grid Array "CCGA"
• Micro BGA Design Guide

"Their designers have the expertise in their craft and the know-how to design products for cost and reliability and get them right the first time, which is critical in today's market."                                

                                            Steve Martin

                                               Samsung USA

• Concept Creation
• Schematic Capture
• Layout Design (All Platforms)
• Thermal, Electronic & Mechanical Engineering
• Circuit Design & Layout (All Platforms)
• Component Libraries​
• High-level architecture and system planning 
• Defining applicable standards and requirements 
• Schematic capture and definition of critical nets 
• Selecting PCB stack up, providing design guidelines and constraints for PCB layout
• Material selection for both Domestic & Offshore 
• Component placement – review 
• Decoupling, bypassing, I/O, and critical routing – review 
• Non-critical routing – review 
• Power and ground planes – review
• Thermal Design & Analysis 
• Mechanical Systems
• ​Environment Control System

• Flexible Circuits
• Custom Rigid
• Rigid-Flex
• Advanced Technology (Stacked Vias)
• RF/Microwave
• mixed signal-digital and analog
•  FPGA high layer
• high current power supplies with Heavy Copper 12oz
• Anywhere Via
• Blind & Buried Micro vias
• ​embedded resistors and Embedded Capacitance
• ​​Controlled Impedance and Differential pair
• Load Boards and DUT Cards​
• ​Multi-Chip Modules (MCM) in LCC, QFP, and BGA Form Factor
• Chip On Board
• Component Stacking​

• Design Bureau (Full Service)
• Flexibility & 24-7 Design Support
• Professionalism
• Moonlighters Option (Low-Cost Design)
• Strong Understanding Of The PCB/PCBA Mfg Process