Layout Design Services
Design is infinitely more complex today, and designers up to that challenge will thrive. Printed Circuit boards are a big part of what's driving today's complexity with mixed signals, higher speeds, power management solutions, and advanced HDI (high-density interconnect). Our designers are incredibly well-versed in what drives signal integrity and manufacturability, and they balance the two exceptionally well.
Our designers can be used for New Prototypes (NPI) or as consultants to evaluate existing product lines for design for manufacturability (DFM). We can support all technology ranging from an easy 2-layer PCB to an advanced 70-layer simulation board.
Services:
- Concept Creation
- Schematic Capture
- Layout Design (All Platforms)
- Thermal, Electronic & Mechanical Engineering
- Circuit Design & Layout (All Platforms)
- Component Libraries
- High-level architecture and system planning
- Defining applicable standards and requirements
- Schematic capture and definition of critical nets
- Selecting PCB stack up, providing design guidelines and constraints for PCB layout
- Material selection for both Domestic & Offshore
- Component placement – review
- Decoupling, bypassing, I/O, and critical routing – review
- Non-critical routing – review
- Power and ground planes – review
- Thermal Design & Analysis
- Mechanical Systems
- Environment Control System
All design platforms available to offer flexibility
Products
- Flexible Circuits
- Custom Rigid
- Rigid-Flex
- Advanced Technology (Stacked Vias)
- RF/Microwave
- mixed signal-digital and analog
- FPGA high layer
- high current power supplies with Heavy Copper 12oz
- Anywhere Via
- Blind & Buried Micro vias
- embedded resistors and Embedded Capacitance
- Controlled Impedance and Differential pair
- Load Boards and DUT Cards
- Multi-Chip Modules (MCM) in LCC, QFP, and BGA Form Factor
- Chip On Board
- Component Stacking
Advanced Designs Services
- High-speed and Impedance Controlled Designs running 13.0 Gbps of 12 lines Serial/differential Signals and 10.0 Gbps of 10 lines Serial/differential Signals
- High Layer count Design up to 70 layers
- Multiple Fine pitch BGA (0.18 mm) and high pin count up to 2464
- Conduction and Air cooled PCB designs
- Bus routing, differential pairs, and length matching. Ultra High-density designs meeting BGA,
- Micro-BGA, PCI, PCIE, CPCI specs up to 500 + pins /sq inch
- High-speed constraint-driven design ensures seamless integration of advanced interfaces such as DDR3, DDR4, SDRAM, XGMII and SGMII PCI Express, SATA, USB 3.0
- Process checks include checking delays through vias, connector pins, and IC package pins for die 2 die length matching and identifying the trace segments crossing voids.
- Layer management for signal integrity and impedance control
- Accelerated Timing closure on all advanced Interfaces
- High-speed digital, integrated RF/analog design, and mixed-signal design
- HDI Designs with Micro Vias, Blind and Buried Vias, and Back Drilled Vias
- Impedance-controlled designs with delay matching, Stack-up, and material selection.
- Pre-route and post-route Signal Integrity Analysis, IBIS Model Creation.
- DFT and DFM rule set compliances
- Options for Back drilling on critical High- speed Signals to avoid Reflections
- Gerber editing capabilities, netlist extraction, and extensive DRC solutions